• DocumentCode
    2537815
  • Title

    CMOS-MEMS transverse-mode square plate resonator with high Q and low motional impedance

  • Author

    Li, Ming-Huang ; Chen, Wen-Chien ; Li, Sheng-Shian

  • Author_Institution
    Inst. of NanoEngineering & Microsyst., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    2011
  • fDate
    5-9 June 2011
  • Firstpage
    1500
  • Lastpage
    1503
  • Abstract
    An integrated CMOS-MEMS transverse-mode square plate resonator centered at 6.52 MHz has been demonstrated with Q´s ranging from 800 to 1,900, and specifically with the lowest motional impedance of 35 kΩ compared to any other CMOS-MEMS counterparts to date by the combination of large transduction area and pull-in mechanism to achieve deep-submicron electrode-to-resonator gap spacing using a foundry-oriented CMOS-MEMS process. In addition, such a resonator is formed by metal/oxide composite structure where the residual stress often seen in CMOS layers is greatly alleviated and where SiO2 with positive temperature coefficient of Young´s Modulus (TCE) offers an effective temperature compensation scheme, therefore greatly improving its thermal stability as compared with mere-metal resonators under the same fabrication technologies.
  • Keywords
    CMOS integrated circuits; Young´s modulus; micromechanical resonators; CMOS-MEMS transverse-mode square plate resonator; Young´s modulus; deep-submicron electrode-to-resonator gap spacing; foundry-oriented CMOS-MEMS process; frequency 6.52 MHz; high Q impedance; low motional impedance; mere-metal resonators; metal-oxide composite structure; residual stress; resistance 35 kohm; temperature compensation scheme; thermal stability; CMOS integrated circuits; Electrodes; Frequency measurement; Impedance; Optical resonators; Resonant frequency; Thermal stability; CMOS-MEMS; Composite Structure; Motional Impedance; Quality Factor; RF MEMS; Resonator;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
  • Conference_Location
    Beijing
  • ISSN
    Pending
  • Print_ISBN
    978-1-4577-0157-3
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2011.5969683
  • Filename
    5969683