• DocumentCode
    2538007
  • Title

    Enhancement and depletion-mode pHEMT using 6 inch GaAs cost-effective production process

  • Author

    Hsieh, Y.Y. ; Hwang, T. ; Yeh, T.J. ; Yuan, C.G. ; Chen, C.J. ; Yeh, P. ; Hwang, J.H. ; Chen, C.H. ; Wu, C.S.

  • Author_Institution
    WIN Semicond. Corp., Tao Yuan Shien, Taiwan
  • fYear
    2004
  • fDate
    24-27 Oct. 2004
  • Firstpage
    111
  • Lastpage
    114
  • Abstract
    A cost effective enhancement/depletion mode pHEMT MMIC process on 6-inch GaAs wafer is demonstrated by using 0.5μm gate-length optical stepper pHEMT technology. E-mode and D-mode gates are deposited simultaneously in this process simplification. The E-mode pHEMT exhibits a pinch-off voltage of +0.22V (defined at 0.1mA/mm), and a maximum extrinsic transconductance of 400mS/mm at room temperature. The off-state current of E-mode device is typically 0.15μA/mm at Vgs=0V and Vds=3V. This current is extreme low and is suitable for high density digital circuits with minimized power consumption. On the other hand, a pinch-off voltage of -0.75V and a transconductance of 370mS/mm has been measured for D-mode pHEMT. Due to excellent DC/RF characteristics and good uniformity of E/D pHEMTs from optimized optical gate lithography and front-side process, the D-mode switch and E-mode digital control circuit constitute a monolithic solution to RF control circuits in WLAN and cell phone applications.
  • Keywords
    III-V semiconductors; MMIC; gallium arsenide; high electron mobility transistors; semiconductor device manufacture; semiconductor technology; voltage measurement; -0.75 V; 0.1524 m; 0.22 V; 0.5 micron; 3 V; D-mode switch; E-mode digital control circuit; GaAs; GaAs wafer; cost-effective production process; depletion-mode pHEMT; enhancement mode pHEMT; maximum extrinsic transconductance; optical stepper pHEMT technology; pHEMT MMIC process; pinch-off voltage; Circuits; Costs; Gallium arsenide; MMICs; PHEMTs; Production; Radio frequency; Temperature; Transconductance; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Compound Semiconductor Integrated Circuit Symposium, 2004. IEEE
  • ISSN
    1550-8781
  • Print_ISBN
    0-7803-8616-7
  • Type

    conf

  • DOI
    10.1109/CSICS.2004.1392506
  • Filename
    1392506