• DocumentCode
    2538157
  • Title

    A high power Q-band MMIC power amplifier based on dual-recess 0.15 μm pHEMT

  • Author

    Wang, Q.H. ; Kao, M.Y. ; Nayak, S. ; Kong, K.S. ; Campbell, C.F.

  • Author_Institution
    TriQuint Semicond., Richardson, TX, USA
  • fYear
    2004
  • fDate
    24-27 Oct. 2004
  • Firstpage
    133
  • Lastpage
    136
  • Abstract
    This paper demonstrates a three stage Q-band power amplifier based on TriQuint´s three metal interconnect (3MI) technology and 0.15μm dual-recess GaAs pHEMT process. The design, fabrication and experimental results of the MMIC amplifier are discussed. The amplifier employed a balanced configuration to achieve higher output power and good return loss. Each half consisted of three amplification stages with a 1:2:2 drive ratio and 12.8 mm of total FET periphery. Utilizing dual recess pHEMT technology the amplifier can be biased at Vds = 6V with 2A quiescent current; an equivalent of 150mA/mm current density. The amplifier can deliver 34 dBm of output power over a 41-46 GHz bandwidth with 15dB gain and typically -15dB return loss. The chip dimensions are 3.4 mm × 4.2 mm. Due to the high-integration level, this Q-band MMIC amplifier enables low cost millimeter-wave RF equipment for potential point to point radio communications and military applications.
  • Keywords
    III-V semiconductors; MMIC power amplifiers; gallium arsenide; high electron mobility transistors; integrated circuit interconnections; millimetre wave devices; power integrated circuits; -15 dB; 0.15 micron; 12.8 mm; 15 dB; 2 A; 41 to 46 GHz; 6 V; GaAs; amplification stage; dual-recess GaAs pHEMT process; high power Q-band MMIC power amplifier; low cost millimeter-wave RF equipment; three metal interconnect technology; three stage Q-band power amplifier; FETs; Fabrication; Gallium arsenide; High power amplifiers; MMICs; PHEMTs; Power amplifiers; Power generation; Process design; Radiofrequency amplifiers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Compound Semiconductor Integrated Circuit Symposium, 2004. IEEE
  • ISSN
    1550-8781
  • Print_ISBN
    0-7803-8616-7
  • Type

    conf

  • DOI
    10.1109/CSICS.2004.1392513
  • Filename
    1392513