Accelerated reliability tests: solder defects exposed

Author

Jawaid, Shams ; Nesbitt, Tom

Author_Institution

Quantum Corp., Milpitas, CA, USA

fYear

1999

fDate

18 -21 Jan 1999

Firstpage

43

Lastpage

49

Abstract

This paper describes methodology to perform risk assessment and establish the quality and reliability of solder joints utilizing accelerated reliability life testing techniques. Temperature cycling tests were performed on equal number of 100-pin quad flat pack package mounted on printed circuit board assemblies from a reworked and nonreworked soldering process. The data showed that the accelerated reliability tests exposed the latent defects inherent in reworked solder joints. The projected field failure rate and the percentage of reworked solder joints failures of the total PCBs shipped was high and unacceptable to meet the products MTBF target

Keywords

failure analysis; life testing; printed circuit testing; reliability; risk management; soldering; 100-pin quad flat pack package; MTBF target; accelerated reliability tests; cycling tests; field failure rate; latent defects; life testing techniques; printed circuit board assemblies; reworked solder joints failures; risk assessment; solder joint defects; soldering process; Assembly; Circuit testing; Electronics packaging; Life estimation; Life testing; Performance evaluation; Printed circuits; Risk management; Soldering; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability and Maintainability Symposium, 1999. Proceedings. Annual

Conference_Location

Washington, DC

Print_ISBN

0-7803-5143-6

Type

conf

DOI

10.1109/RAMS.1999.744095

Filename

744095