• DocumentCode
    2538210
  • Title

    Electronic-module environmental-stress-screening data-evaluation technique

  • Author

    Palmer, Jeffery D.

  • Author_Institution
    Lockheed Martin Tactical Aircraft Syst., Fort Worth, TX, USA
  • fYear
    1999
  • fDate
    18 -21 Jan 1999
  • Firstpage
    50
  • Lastpage
    56
  • Abstract
    This report has provided a reliability engineering analysis technique to support optimization decisions for a production environmental stress screening (ESS) program and demonstrated its use. The important groundrules used in this analysis are: (1) a disciplined approach to the ESS process is required for the results of this analysis to be effective; and (2) the failures per thermal cycle should be distributed equally throughout the cycle in order to represent a realistic scenario. The benefits associated with the analysis technique include: (1) the parameter, “failures per thermal cycle”, has a simple accounting method and is easy to accurately collect; and (2) the tools are PC based and facilitate timely reaction to management requests. The observations made during the generation of this report are: (1) all ESS failures must be analyzed for root cause and effective corrective action; (2) the input data to the analysis technique must be completely understood so that the results of the optimization decision process are prudent; and (3) feedback from field performance is a vital element in the optimization process
  • Keywords
    environmental stress screening; failure analysis; optimisation; reliability; PC; data evaluation technique; effective corrective action; electronic modules; failures per thermal cycle; optimization decisions; production environmental stress screening; reliability engineering analysis technique; root cause; Cause effect analysis; Data analysis; Electronic switching systems; Failure analysis; Feedback; Performance analysis; Production; Reliability engineering; Thermal management; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability and Maintainability Symposium, 1999. Proceedings. Annual
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-5143-6
  • Type

    conf

  • DOI
    10.1109/RAMS.1999.744096
  • Filename
    744096