Title :
Hierarchical test generation: Taking boundary scan to the next level
Author_Institution :
Teradyne Inc., Boston, MA, USA
Abstract :
Development of the original IEEE 1149.1 boundary-scan standard in 1990 was motivated primarily by concerns about the complexity of testing increasingly dense printed-circuit board assemblies in manufacturing. As a result, most test generation efforts have been targeted at unit test, which is most applicable to testing MCMs and boards. As boundary-scan technology has matured, there is a new focus on extending the technique to testing all levels of an assembly´s hierarchy, at all phases in its life cycle
Keywords :
IEEE standards; assembling; automatic testing; boundary scan testing; multichip modules; printed circuit testing; production testing; IEEE 1149.1; MCMs; assembly hierarchy; boundary scan; dense printed-circuit board assemblies; hierarchical test generation; life cycle; manufacturing; Assembly; Automatic testing; Circuit faults; Circuit testing; Electrical fault detection; Electronic equipment testing; Fault detection; Fixtures; Life testing; Packaging;
Conference_Titel :
AUTOTESTCON '96, Test Technology and Commercialization. Conference Record
Conference_Location :
Dayton, OH
Print_ISBN :
0-7803-3379-9
DOI :
10.1109/AUTEST.1996.547732