Title :
A novel vacuum-packaged low-power scanning mirror with inclined 3D-shaped window
Author :
Hofmann, U. ; Quenzer, H.J. ; Eisermann, C. ; Janes, J. ; Schroeder, C. ; Jensen, B. ; Hagge, J. ; Soerensen, F. ; Senger, F. ; Vick, D. ; Schwarzelbach, O. ; Ratzmann, L. ; Giese, T. ; Wagner, B. ; Benecke, W.
Author_Institution :
Fraunhofer Inst. for Silicon Technol. ISIT, Itzehoe, Germany
Abstract :
MEMS based laser projection is of high interest for automotive head-up displays and dashboard displays, as well as for an increasing number of personal mobile projection applications. These applications require scanning mirrors that offer high scan frequencies and wide scan angles while showing low power consumption. This paper presents a novel low-power high-Q scanning mirror that is vacuum encapsulated on wafer level and thereby exhibits Q-factors exceeding 145,000. A new glass forming process enables fabrication of glass wafers with inclined 3D-shaped windows needed to spatially separate the direct reflex from the projected image.
Keywords :
encapsulation; forming processes; head-up displays; laser beam applications; micro-optomechanical devices; mirrors; optical fabrication; optical projectors; optical scanners; optical windows; wafer level packaging; 3D shaped windows; MEMS based laser projection; automotive head up displays; dashboard displays; glass forming process; glass wafers; inclined 3D shaped window; low power high-Q scanning mirror; personal mobile projection application; scanning mirrors; vacuum encapsulated; vacuum packaged low power scanning mirror; Glass; Lasers; Micromechanical devices; Mirrors; Optical device fabrication; Silicon; Windows; MEMS; electrostatic comb drive; glass forming; laser projection; mirror; vacuum wafer level package;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
Print_ISBN :
978-1-4577-0157-3
DOI :
10.1109/TRANSDUCERS.2011.5969728
