A novel vacuum-packaged low-power scanning mirror with inclined 3D-shaped window

Author

Hofmann, U. ; Quenzer, H.J. ; Eisermann, C. ; Janes, J. ; Schroeder, C. ; Jensen, B. ; Hagge, J. ; Soerensen, F. ; Senger, F. ; Vick, D. ; Schwarzelbach, O. ; Ratzmann, L. ; Giese, T. ; Wagner, B. ; Benecke, W.

Author_Institution

Fraunhofer Inst. for Silicon Technol. ISIT, Itzehoe, Germany

fYear

2011

fDate

5-9 June 2011

Firstpage

1527

Lastpage

1530

Abstract

MEMS based laser projection is of high interest for automotive head-up displays and dashboard displays, as well as for an increasing number of personal mobile projection applications. These applications require scanning mirrors that offer high scan frequencies and wide scan angles while showing low power consumption. This paper presents a novel low-power high-Q scanning mirror that is vacuum encapsulated on wafer level and thereby exhibits Q-factors exceeding 145,000. A new glass forming process enables fabrication of glass wafers with inclined 3D-shaped windows needed to spatially separate the direct reflex from the projected image.

Keywords

encapsulation; forming processes; head-up displays; laser beam applications; micro-optomechanical devices; mirrors; optical fabrication; optical projectors; optical scanners; optical windows; wafer level packaging; 3D shaped windows; MEMS based laser projection; automotive head up displays; dashboard displays; glass forming process; glass wafers; inclined 3D shaped window; low power high-Q scanning mirror; personal mobile projection application; scanning mirrors; vacuum encapsulated; vacuum packaged low power scanning mirror; Glass; Lasers; Micromechanical devices; Mirrors; Optical device fabrication; Silicon; Windows; MEMS; electrostatic comb drive; glass forming; laser projection; mirror; vacuum wafer level package;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International

Conference_Location

Beijing

ISSN

Pending

Print_ISBN

978-1-4577-0157-3

Type

conf

DOI

10.1109/TRANSDUCERS.2011.5969728

Filename

5969728