Title :
Application of Improved BCC Algorithm and RBFNN in Identification of Defect Parameters
Author :
Wei, Kou ; Feng-rui, Sun ; Li, Yang ; Lin-gen, Chen
Author_Institution :
Coll. of Naval Archit. & Power, Naval Univ. of Eng., Wuhan, China
Abstract :
The identification of defect parameters in thermal non-destructive test and evaluation (TNDT/E) was considered as a kind of inverse heat transfer problem (IHTP) and a kind of structure design optimization problem, and the design results should meet the surface temperature profile of the apparatus with defects. An improved bacterial colony chemo taxis (IBCC) optimization algorithm and a radial basis function neural network (RBFNN) are applied to the identification of defects parameters. The RBFNN is a precise and convenient surrogate model for the time costly finite element computation, which obtains the surface temperature with different defect parameters. The IBCC optimization algorithm is derivatively-free, and the convergence speed is fast. This method is applied to a simple verification case and the result is acceptable. The algorithm is also compared with the particle swarm optimization (PSO) algorithm, and the IBCC algorithm can access the optimum with faster speed.
Keywords :
cell motility; finite element analysis; heat transfer; inverse problems; nondestructive testing; optimisation; radial basis function networks; RBFNN; bacterial colony chemotaxis optimization algorithm; defect parameter identification; finite element computation; improved BCC algorithm; inverse heat transfer problem; particle swarm optimization; radial basis function neural network; structure design optimization problem; surface temperature profile; thermal nondestructive test; Artificial neural networks; Computational modeling; Heat transfer; Microorganisms; Optimization; Shape; Temperature measurement; Bacterial colony chemotaxis algorithm; defect; identification; inverse heat transfer problem; radial basis function neural network;
Conference_Titel :
Genetic and Evolutionary Computing (ICGEC), 2010 Fourth International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4244-8891-9
Electronic_ISBN :
978-0-7695-4281-2
DOI :
10.1109/ICGEC.2010.47