• DocumentCode
    2538992
  • Title

    Failure assessment software for circuit card assemblies

  • Author

    Osterman, Michael ; Stadterman, Thomas

  • Author_Institution
    CALCE Electron. Products & Syst. Center, Maryland Univ., College Park, MD, USA
  • fYear
    1999
  • fDate
    18 -21 Jan 1999
  • Firstpage
    269
  • Lastpage
    276
  • Abstract
    Up-front failure analysis of circuit card assembly designs can dramatically reduce cost of ownership, increase product reliability, and thus reduce risks. In this paper, the design process for electronic products is discussed in terms of failure assessment activity. Information resources necessary to support the failure assessment activity are discussed. Finally, the effectiveness of failure assessment software is demonstrated by analyzing circuit card assemblies (CCAs) from a military radio control module using the calcePWA software developed by the CALCE Electronic Products and Systems Center (EPSC) at the University of Maryland
  • Keywords
    circuit reliability; electronic engineering computing; failure analysis; military equipment; printed circuit design; software packages; telecontrol; CALCE Electronic Products and Systems Center; Maryland University; calcePWA software; circuit card assemblies; cost of ownership reduction; electronic products design process; failure assessment activity; failure assessment software; military radio control module; product reliability increase; risks reduction; up-front failure analysis; Assembly systems; Circuits; Consumer electronics; Costs; Failure analysis; Performance analysis; Process design; Risk analysis; Risk management; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability and Maintainability Symposium, 1999. Proceedings. Annual
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-5143-6
  • Type

    conf

  • DOI
    10.1109/RAMS.1999.744130
  • Filename
    744130