Title :
Failure assessment software for circuit card assemblies
Author :
Osterman, Michael ; Stadterman, Thomas
Author_Institution :
CALCE Electron. Products & Syst. Center, Maryland Univ., College Park, MD, USA
Abstract :
Up-front failure analysis of circuit card assembly designs can dramatically reduce cost of ownership, increase product reliability, and thus reduce risks. In this paper, the design process for electronic products is discussed in terms of failure assessment activity. Information resources necessary to support the failure assessment activity are discussed. Finally, the effectiveness of failure assessment software is demonstrated by analyzing circuit card assemblies (CCAs) from a military radio control module using the calcePWA software developed by the CALCE Electronic Products and Systems Center (EPSC) at the University of Maryland
Keywords :
circuit reliability; electronic engineering computing; failure analysis; military equipment; printed circuit design; software packages; telecontrol; CALCE Electronic Products and Systems Center; Maryland University; calcePWA software; circuit card assemblies; cost of ownership reduction; electronic products design process; failure assessment activity; failure assessment software; military radio control module; product reliability increase; risks reduction; up-front failure analysis; Assembly systems; Circuits; Consumer electronics; Costs; Failure analysis; Performance analysis; Process design; Risk analysis; Risk management; Testing;
Conference_Titel :
Reliability and Maintainability Symposium, 1999. Proceedings. Annual
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-5143-6
DOI :
10.1109/RAMS.1999.744130
