DocumentCode
2539032
Title
Recent progress in packaging of RF MEMS
Author
Seki, Tomonori
Author_Institution
Adv. Device Lab., OMRON Corp., Kyoto, Japan
fYear
2004
fDate
24-27 Oct. 2004
Firstpage
233
Lastpage
236
Abstract
RF MEMS devices utilized micromachining technologies offer a high performance to several RF applications. However packaging for devices have reduced performance problem when integrated to another RF devices. This paper reviews the recent progress in packaging of RF MEMS especially switching devices. And, a novel method of wafer level packaging for RF-MEMS switch was described.
Keywords
micromachining; micromechanical devices; microwave switches; packaging; RF MEMS devices; RF MEMS packaging; frit glass; micromachining technologies; switching devices; wafer level packaging; Actuators; Contacts; Electrodes; Glass; Packaging; Radio frequency; Radiofrequency microelectromechanical systems; Silicon; Switches; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Compound Semiconductor Integrated Circuit Symposium, 2004. IEEE
ISSN
1550-8781
Print_ISBN
0-7803-8616-7
Type
conf
DOI
10.1109/CSICS.2004.1392547
Filename
1392547
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