• DocumentCode
    2539043
  • Title

    AuSn solder in photonics assembly

  • Author

    Oppermann, Hermann

  • Author_Institution
    Fraunhofer IZM, Berlin, Germany
  • fYear
    2009
  • fDate
    4-8 Oct. 2009
  • Firstpage
    61
  • Lastpage
    62
  • Abstract
    Soldering is used today in various applications and therefore has to fulfill different requirements. In photonics integration AuSn solder plays a special role. It is used as a fluxless process which is mandatory in order to avoid any contamination of optical surfaces. Post cleaning processes are often excluded as the results are often not satisfying and difficult to monitor. For optical alignment often a post bonding accuracy of 1 mum is required. This will need a precise bonder or self-alignment capability provided by the solder. To keep the position stability for long time AuSn is especially recommended due to the high creep resistance up to high temperatures.
  • Keywords
    gold alloys; photonic crystals; soldering; AuSn; optical surfaces; photonics assembly; post cleaning processes; soldering; Assembly; Bonding; Cleaning; Creep; Monitoring; Photonics; Soldering; Stability; Surface contamination; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    LEOS Annual Meeting Conference Proceedings, 2009. LEOS '09. IEEE
  • Conference_Location
    Belek-Antalya
  • ISSN
    1092-8081
  • Print_ISBN
    978-1-4244-3680-4
  • Electronic_ISBN
    1092-8081
  • Type

    conf

  • DOI
    10.1109/LEOS.2009.5343468
  • Filename
    5343468