DocumentCode
2539043
Title
AuSn solder in photonics assembly
Author
Oppermann, Hermann
Author_Institution
Fraunhofer IZM, Berlin, Germany
fYear
2009
fDate
4-8 Oct. 2009
Firstpage
61
Lastpage
62
Abstract
Soldering is used today in various applications and therefore has to fulfill different requirements. In photonics integration AuSn solder plays a special role. It is used as a fluxless process which is mandatory in order to avoid any contamination of optical surfaces. Post cleaning processes are often excluded as the results are often not satisfying and difficult to monitor. For optical alignment often a post bonding accuracy of 1 mum is required. This will need a precise bonder or self-alignment capability provided by the solder. To keep the position stability for long time AuSn is especially recommended due to the high creep resistance up to high temperatures.
Keywords
gold alloys; photonic crystals; soldering; AuSn; optical surfaces; photonics assembly; post cleaning processes; soldering; Assembly; Bonding; Cleaning; Creep; Monitoring; Photonics; Soldering; Stability; Surface contamination; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
LEOS Annual Meeting Conference Proceedings, 2009. LEOS '09. IEEE
Conference_Location
Belek-Antalya
ISSN
1092-8081
Print_ISBN
978-1-4244-3680-4
Electronic_ISBN
1092-8081
Type
conf
DOI
10.1109/LEOS.2009.5343468
Filename
5343468
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