• DocumentCode
    2539072
  • Title

    Wafer-level hermetic vacuum micro-packaging technology for IR detector applications

  • Author

    García-Blanco, S. ; LeFoulgoc, K. ; Desroches, Y. ; Caron, J.S. ; Topart, P. ; Alain, C. ; Jerominek, H.

  • Author_Institution
    INO, Quebec City, QC, Canada
  • fYear
    2009
  • fDate
    4-8 Oct. 2009
  • Firstpage
    57
  • Lastpage
    58
  • Abstract
    A low-cost low temperature wafer-level vacuum micropackage has been developed exhibiting an equivalent flow rate of 3.8times10-14 Torr.L/sec for storage at 80degC.
  • Keywords
    bolometers; cryogenic electronics; infrared detectors; micro-optomechanical devices; vacuum techniques; wafer level packaging; IR detector; MEMS; hermetic vacuum micropackaging technology; infrared detector; low temperature packaging; microbolometer; temperature 80 C; wafer-level packaging; Assembly; Costs; Infrared detectors; Micromechanical devices; Packaging; Space technology; Submillimeter wave technology; Temperature; Vacuum technology; Wafer scale integration; MEMS; hermetic; microbolometer; micropackaging; vacuum; wafer-level packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    LEOS Annual Meeting Conference Proceedings, 2009. LEOS '09. IEEE
  • Conference_Location
    Belek-Antalya
  • ISSN
    1092-8081
  • Print_ISBN
    978-1-4244-3680-4
  • Electronic_ISBN
    1092-8081
  • Type

    conf

  • DOI
    10.1109/LEOS.2009.5343470
  • Filename
    5343470
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2539072