Title :
Surface activation based nanobonding technologies for optoelectronics packaging
Author :
Howlader, M.M.R.
Author_Institution :
Electr. & Comput. Eng. Dept., McMaster Univ., Hamilton, ON, Canada
Abstract :
This article discusses the potential of surface activation based nanobonding technologies. Three-strategies of the nanobonding technologies with a number of applications such as the bonding of copper nanobumps, III-V materials and ionic materials have been discussed.
Keywords :
bonding processes; copper; electronics packaging; integrated optoelectronics; interconnections; nanoelectronics; surface treatment; copper nanobumps bonding; high density interconnection; ionic material bonding; nanobonding technologies; optoelectronics packaging; surface activation; Packaging; Surface activation; interconnection; nanobonding; optoelectronics; packaging;
Conference_Titel :
LEOS Annual Meeting Conference Proceedings, 2009. LEOS '09. IEEE
Conference_Location :
Belek-Antalya
Print_ISBN :
978-1-4244-3680-4
Electronic_ISBN :
1092-8081
DOI :
10.1109/LEOS.2009.5343473
