Title :
Solutions to the fabrication problems of hybrid optoelectronic VLSI CMOS chips
Author_Institution :
Bell Labs., Lucent Technol., Murray Hill, NJ, USA
Abstract :
Summary form only given. In the present work, done with numerous collaborators at Bell Laboratories, we describe solutions to the fabrication problems in scaling up the hybrid CMOS technology to VLSI. The application to a high speed ATM switching fabric required 8704 micro solder bonds.
Keywords :
CMOS integrated circuits; VLSI; integrated circuit technology; integrated optoelectronics; optical fabrication; soldering; Bell Laboratories; VLSI; high speed ATM switching fabric; hybrid CMOS technology; hybrid optoelectronic VLSI CMOS chip fabrication; micro solder bonds; Bonding; Diodes; Etching; Gallium arsenide; Optical device fabrication; Optical modulation; Photodetectors; Quantum well devices; Silicon; Very large scale integration;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1996. LEOS 96., IEEE
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-3160-5
DOI :
10.1109/LEOS.1996.571542
