• DocumentCode
    2539690
  • Title

    A thirty two element phased-array transceiver at 60GHz with RF-IF conversion block in 90nm flip chip CMOS process

  • Author

    Cohen, Emanuel ; Jakobson, Claudio ; Ravid, Shmuel ; Ritter, Dan

  • Author_Institution
    Mobile Wireless Group, Intel Haifa, Haifa, Israel
  • fYear
    2010
  • fDate
    23-25 May 2010
  • Firstpage
    457
  • Lastpage
    460
  • Abstract
    A 60 GHz 32 element bidirectional phased-array TX/RX chip with a 2 bit phase shifter and IF converter to/from 12GHz, using 90nm CMOS process, is described. The array features 12.5 dB gain, noise figure (NF) of 11 dB, IP1dB of -17dbm for RX, and total output Psat of +8dBm for TX, drawing 390 mA from a 1.3-V supply. The RMS amplitude and phase error of the phase shifter is 0.8dB and 5° max respectively from 57 to 66 GHz. The paper emphasizes the flip-chip assembly technology selected and its impact on performance, and the phase and amplitude errors resulted by physical impairments such as the finite isolation between different chains. Special test structures were designed to measure bump isolation and insertion loss (IL). The designed architecture together with the compact layout results in a die area of 14.5mm2 for the full array. To our knowledge, this is the first report on a large bidirectional 60 GHz array, with the lowest reported chip power consumption and size.
  • Keywords
    CMOS integrated circuits; flip-chip devices; phase shifters; RF-IF conversion block; amplitude error; bump isolation; flip chip CMOS process; flip-chip assembly technology; frequency 57 GHz to 66 GHz; frequency 60 GHz; gain 12.5 dB; insertion loss; phase error; phase shifter; phased-array transceiver; size 90 nm; Assembly; CMOS process; Flip chip; Gain; Isolation technology; Noise figure; Noise measurement; Paper technology; Phase shifters; Transceivers; 60 GHz; Phased-array; bidirectional; flip chip; phase shifter; power consumption;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radio Frequency Integrated Circuits Symposium (RFIC), 2010 IEEE
  • Conference_Location
    Anaheim, CA
  • ISSN
    1529-2517
  • Print_ISBN
    978-1-4244-6240-7
  • Type

    conf

  • DOI
    10.1109/RFIC.2010.5477393
  • Filename
    5477393