DocumentCode :
2539716
Title :
Growth of horizontally aligned carbon nanotubes from designated sidewalls of DRIE-etched silicon trench
Author :
Lu, Jingyu ; Miao, Jianmin ; Xu, Ting
Author_Institution :
Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
fYear :
2011
fDate :
5-9 June 2011
Firstpage :
637
Lastpage :
640
Abstract :
Horizontally aligned carbon nanotubes (HACNTs) were grown from designated trench sidewalls in silicon substrate with chemical vapor deposition (CVD) system. The silicon trenches were fabricated with microelectromechanical system (MEMS) technology, and Fe catalysts were deposited onto the selected trench sidewalls by tilt angle electron beam evaporation. Characterizations of the as-grown CNTs were performed with scanning electron microscopy (SEM), transmission electron microscopy (TEM), Raman spectroscopy and current-voltage measurement. The good horizontal alignment is mainly attributed to the van der Waals interaction within these dense CNTs. The growth of HACNTs, together with their good electrical performance will inspire further efforts towards their application in micro/nanoelectronics.
Keywords :
Raman spectra; carbon nanotubes; catalysts; chemical vapour deposition; iron; microfabrication; micromechanical devices; nanofabrication; scanning electron microscopy; sputter etching; transmission electron microscopy; van der Waals forces; DRIE etched silicon trench; Fe catalysts; HACNT; Raman spectroscopy; chemical vapor deposition; current-voltage measurement; deep reactive ion etching; fabrication; horizontally aligned carbon nanotubes; microelectromechanical system; microelectronics; nanoelectronics; sidewalls; silicon substrate; tilt angle electron beam evaporation. scanning electron microscopy; transmission electron microscopy; van der Waals interaction; Carbon nanotubes; Iron; Nanoelectronics; Physics; Resists; Silicon; Substrates; carbon nanotubes; horizontal; sidewall; trench;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
ISSN :
Pending
Print_ISBN :
978-1-4577-0157-3
Type :
conf
DOI :
10.1109/TRANSDUCERS.2011.5969787
Filename :
5969787
Link To Document :
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