DocumentCode
2540032
Title
Molecular dynamics simulation of self-sputtering of plasma facing material, Be
Author
Ueda, S. ; Ohsaka, T. ; Kuwajima, S.
Author_Institution
JAERI, Ibaraki, Japan
Volume
2
fYear
1995
fDate
30 Sep-5 Oct 1995
Firstpage
952
Abstract
Sputtering phenomenon can be evaluated by the molecular dynamics simulation approach as well as the experimental approach. Authors developed the evaluation system of sputtering using molecular dynamics and investigated the feasibility of this approach. This approach was applied to self-sputtering of beryllium because a selection of interatomic potential was comparatively easy. The energy of incident particles ranged from 30 to 300 electron-volts (eV). The incident angle was changed from 0 to 75 degrees normal to the surface of beryllium target. The sputtering yield and damage due to an incident particle was calculated using this approach. The results were compared with ones from references. The subjects was described when this approach was applied to the sputtering rate of plasma facing material
Keywords
beryllium; fusion reactor materials; fusion reactors; molecular dynamics method; numerical analysis; sputtering; 30 to 300 eV; Be; interatomic potential; molecular dynamics simulation; plasma facing material; self-sputtering; sputtering yield; Analytical models; Application software; Computational modeling; Cyclic redundancy check; Numerical simulation; Plasma applications; Plasma materials processing; Plasma simulation; Power engineering and energy; Sputtering;
fLanguage
English
Publisher
ieee
Conference_Titel
Fusion Engineering, 1995. SOFE '95. Seeking a New Energy Era., 16th IEEE/NPSS Symposium
Conference_Location
Champaign, IL
Print_ISBN
0-7803-2969-4
Type
conf
DOI
10.1109/FUSION.1995.534382
Filename
534382
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