‘Pickup and place’ integration method of bridging carbon nanotubes by stamping transfer

This paper reports an integration method of bridging-structural CNTs (carbon nanotubes) onto a Si wafer using stamping transfer. The bridging-structural CNTs which were directly synthesized by CVD (chemical vapor deposition) between two Si microstructures were picked up by PDMS (polydimethylsiloxane) stamping sheet. The picked up bridging-structural CNTs and the supporting Si microstructures were then placed onto the Si wafer. These transfers were achieved by controlling the adhesion forces between Si and PDMS sheet. From an SEM imaging, we confirmed that our method could transfer the bridging-structural CNTs onto the Si wafer. By measuring the G/D ratio of the bridging-structural CNTs at each transfer process, we confirmed that our transfer method was low damage process.