DocumentCode
2540690
Title
Thermal energy harvesting using shape memory/piezoelectric composites
Author
Lebedev, G.A. ; Gusarov, B.V. ; Viala, B. ; Delamare, J. ; Cugat, O. ; Lafont, T. ; Zakharov, D.I.
Author_Institution
CEA, LETI, Grenoble, France
fYear
2011
fDate
5-9 June 2011
Firstpage
669
Lastpage
670
Abstract
The increasing demand in alternative energy sources for low-power electronics gives rise to substantial research activity in the field of energy harvesting devices in recent years. Among the different energy sources, thermal sources can be used to produce electrical energy by means of thermoelectric materials, which exploit Seebeck effect [1], or pyroelectric materials [2]. However, thermoelectric devices require large spatial temperature gradients in order to be efficient. In much the same way, pyroelectric materials are inefficient with slow variations of ambient temperature. Nevertheless there is a possibility to convert indirectly thermal energy into electrical energy through mechanical transformations [3]. Taking advantage of the large mechanical deformation (up to 10% [4]) of shape memory alloys (SMA) in the vicinity of their thermally induced phase transition one can convert this mechanical energy into electrical energy with relatively good efficiency by coupling SMA with piezoelectric materials.
Keywords
Seebeck effect; energy harvesting; piezoelectric materials; thermoelectric devices; Seebeck effect; alternative energy sources; coupling SMA; electrical energy; low power electronics; mechanical deformation; mechanical energy; mechanical transformations; piezoelectric composites; piezoelectric materials; pyroelectric materials; shape memory alloys; spatial temperature gradients; thermal energy harvesting; thermally induced phase transition; thermoelectric devices; thermoelectric materials; Energy harvesting; Frequency modulation; Heating; Materials; Shape memory alloys; Temperature measurement; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location
Beijing
ISSN
Pending
Print_ISBN
978-1-4577-0157-3
Type
conf
DOI
10.1109/TRANSDUCERS.2011.5969842
Filename
5969842
Link To Document