DocumentCode :
2540873
Title :
Power enhancement of micro thermoelectric generators by micro fluidic heat transfer packaging
Author :
Wojtas, N.Z. ; Schwyter, E. ; Glatz, W. ; Kühne, S. ; Escher, W. ; Hierold, C.
Author_Institution :
Micro & Nanosystems, ETH Zurich, Zurich, Switzerland
fYear :
2011
fDate :
5-9 June 2011
Firstpage :
731
Lastpage :
734
Abstract :
This paper reports the design, fabrication and proof of concept of a multilayer fluidic packaging system enabling an increase in the output power performance of micro thermoelectric generators (μTEGs). The complete integration of the fluidic heat transfer system (HTS) with a μTEG is successfully demonstrated. The fabricated μHTS prototypes were tested with respect to their heat transfer resistance and consumed pumping power. A heat transfer resistance of 0.48cm2K/W was achieved with a small pumping power of 3.7mW/cm2. This results in a potential μTEG power output enhancement of 38 times at a heat source temperature of 320K, cold side temperature of 300K and a thermoelectric figure of merit (Z) of 1.1×10-3 K-1.
Keywords :
heat transfer; microfluidics; packaging; thermoelectric conversion; micro fluidic heat transfer packaging; micro thermoelectric generators; multilayer fluidic packaging system; power enhancement; Copper; Heat sinks; Heat transfer; High temperature superconductors; Manifolds; Resistance; Resistance heating; Thermoelectric power generation; heat transfer resistance; micro fluidic packaging; micro heat transfer systems;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
ISSN :
Pending
Print_ISBN :
978-1-4577-0157-3
Type :
conf
DOI :
10.1109/TRANSDUCERS.2011.5969853
Filename :
5969853
Link To Document :
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