DocumentCode
2541421
Title
Programmable self-assembly for microsystem integration
Author
Hoo, J.H. ; Park, K.S. ; Baskaran, R. ; Böhringer, K.F.
Author_Institution
Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
fYear
2011
fDate
5-9 June 2011
Firstpage
848
Lastpage
853
Abstract
We present microscale self-assembly as a suite of techniques that promotes the electronics industry´s initiative towards functional diversification and function densification, and two specific programmable self-assembly projects that are driven by real-world limitations and aspirations of present assembly and packaging technologies. Towards said goals, we demonstrate that our processes can improve existing assembly and packaging techniques, and also enable possibilities restricted by current industry methodologies.
Keywords
electronics industry; electronics packaging; micromechanical devices; self-assembly; electronics industrys; function densification; functional diversification; microsystem integration; packaging techniques; programmable self-assembly; Assembly; Legged locomotion; Packaging; Self-assembly; Silicon; Substrates; Surface treatment; Self-assembly; assembly; heterogeneous integration; packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location
Beijing
ISSN
Pending
Print_ISBN
978-1-4577-0157-3
Type
conf
DOI
10.1109/TRANSDUCERS.2011.5969886
Filename
5969886
Link To Document