DocumentCode
2542902
Title
Dielectric spectroscopy of the characterization of the structure of amorphous polymeric materials
Author
Bernes, Alain ; Chatain, Daniel ; Fauran-Clavel, Marie-Josee ; Lacabanne, Colette ; Ibar, Jean-Pierre
Author_Institution
Solomat France SA, Ballainvilliers, France
fYear
1988
fDate
12-16 Sep 1988
Firstpage
731
Abstract
Thermally stimulated current spectroscopy has been applied to the characterization of the structure of amorphous polymers such as polycarbonate. The existence of a sub-T g mode that is very sensitive to local order, induced by thermal treatment, has been shown. The dielectric manifestation of the glass transition has been resolved into two components. The lower-temperature one (α1 ) is always observed, independently of the thermodynamic history of the polycarbonate. The corresponding relaxation times follow a compensation law with a compensation temperature given for the reference state by the empirical relationship found for semicrystalline polymers. On the other hand, the upper temperature one (αu) is only observed after annealing above T g. It is also characterized by a compensation law indicative of the existence of a segregated phase. It has been assigned to ordered nodules of some 20 to 40 Å, previously observed by electron microscopy and X-ray diffraction
Keywords
amorphous state; annealing; dielectric relaxation; glass transition (polymers); polymer structure; polymers; spectra of organic molecules and substances; thermally stimulated currents; amorphous polymeric materials; annealing; compensation law; compensation temperature; glass transition; local order sensitivity; polycarbonate; reference state; relaxation times; segregated phase; semicrystalline polymers; sub-Tg mode; thermal treatment; thermally stimulated current spectroscopy; Amorphous materials; Annealing; Dielectrics; Electrochemical impedance spectroscopy; Electrons; Glass; History; Polymers; Temperature; Thermodynamics;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials, 1988. Proceedings., Second International Conference on Properties and Applications of
Conference_Location
Beijing
Type
conf
DOI
10.1109/ICPADM.1988.38504
Filename
38504
Link To Document