DocumentCode :
2542902
Title :
Dielectric spectroscopy of the characterization of the structure of amorphous polymeric materials
Author :
Bernes, Alain ; Chatain, Daniel ; Fauran-Clavel, Marie-Josee ; Lacabanne, Colette ; Ibar, Jean-Pierre
Author_Institution :
Solomat France SA, Ballainvilliers, France
fYear :
1988
fDate :
12-16 Sep 1988
Firstpage :
731
Abstract :
Thermally stimulated current spectroscopy has been applied to the characterization of the structure of amorphous polymers such as polycarbonate. The existence of a sub-Tg mode that is very sensitive to local order, induced by thermal treatment, has been shown. The dielectric manifestation of the glass transition has been resolved into two components. The lower-temperature one (α1 ) is always observed, independently of the thermodynamic history of the polycarbonate. The corresponding relaxation times follow a compensation law with a compensation temperature given for the reference state by the empirical relationship found for semicrystalline polymers. On the other hand, the upper temperature one (αu) is only observed after annealing above Tg. It is also characterized by a compensation law indicative of the existence of a segregated phase. It has been assigned to ordered nodules of some 20 to 40 Å, previously observed by electron microscopy and X-ray diffraction
Keywords :
amorphous state; annealing; dielectric relaxation; glass transition (polymers); polymer structure; polymers; spectra of organic molecules and substances; thermally stimulated currents; amorphous polymeric materials; annealing; compensation law; compensation temperature; glass transition; local order sensitivity; polycarbonate; reference state; relaxation times; segregated phase; semicrystalline polymers; sub-Tg mode; thermal treatment; thermally stimulated current spectroscopy; Amorphous materials; Annealing; Dielectrics; Electrochemical impedance spectroscopy; Electrons; Glass; History; Polymers; Temperature; Thermodynamics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials, 1988. Proceedings., Second International Conference on Properties and Applications of
Conference_Location :
Beijing
Type :
conf
DOI :
10.1109/ICPADM.1988.38504
Filename :
38504
Link To Document :
بازگشت