Title :
Dielectric spectroscopy for the characterization of the microstructure of latexes
Author :
Cebeillac, Pascale ; Faurann-Clavel, M.-J. ; Lacabanne, Colette ; Dupuis, Patrick
Author_Institution :
Paul Sabatier Univ., Toulouse, France
Abstract :
A TSC (thermally stimulated current) study of n-butyl acrylate styrene copolymers has shown the influence of polymerization conditions on the microstructure of those amorphous copolymers. The semicontinuous introduction of monomers gives a relatively homogeneous statistical copolymer. Indeed the TSC peak observed around T g is due to elementary process following a single compensation law. DSC data (differential scanning calorimetry) are consistent with this result since the DSC trace is characteristic of a monophasic polymer. The stepwise introduction of monomers leads to a block copolymer. Two TSC peaks are observed in the same temperature region, while the DSC spectrum only shows the existence of a broad transition region. The fine structure of the TSC peaks is well described by two compensation laws and thus confirms the presence of two well-resolved mechanisms. These results are indicative of a core shell structure
Keywords :
amorphous state; dielectric relaxation; glass transition (polymers); polymer blends; polymer structure; polymerisation; spectra of organic molecules and substances; thermally stimulated currents; TSC; amorphous copolymers; block copolymer; compensation laws; core shell structure; dielectric relaxation; dielectric spectroscopy; differential scanning calorimetry; homogeneous statistical copolymer; latexes; microstructure; monophasic polymer; n-butyl acrylate styrene copolymers; polymerization conditions; thermally stimulated current; Amorphous materials; Dielectrics; Electrochemical impedance spectroscopy; Glass; Microstructure; Polarization; Polymers; Structural shells; Synthetic aperture sonar; Temperature distribution;
Conference_Titel :
Properties and Applications of Dielectric Materials, 1988. Proceedings., Second International Conference on Properties and Applications of
Conference_Location :
Beijing
DOI :
10.1109/ICPADM.1988.38505