Title :
Solving packaging issues for low-cost Si integrated optical components
Author :
Harpin, Mr Arnold P R
Author_Institution :
Bookham Technol. Ltd., Rutherford Appleton Lab., Chilton, UK
Abstract :
Silicon is a viable optical material and it is anticipated that its impact will be as great as its impact in the electronics field. This is because ofthe ability to micromachine and cheaply package integrated optical components made with silicon. This potentially opens up whole new vistas to integrated optics such as fibres to the home.
Keywords :
integrated circuit packaging; integrated optics; micromachining; optical communication equipment; optical fibre subscriber loops; silicon; Si; cheaply package; electronics field; fibres to the home; integrated optical components; low-cost Si integrated optical components; micromachine; optical material; packaging issues; Fiber lasers; Optical devices; Optical fiber devices; Optical interferometry; Optical refraction; Optical variables control; Optical waveguides; Packaging; Silicon; Waveguide lasers;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1996. LEOS 96., IEEE
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-3160-5
DOI :
10.1109/LEOS.1996.571572
