Title :
Flip-chip bonding of high-speed laser diodes
Author :
Lindgren, Stefan ; Åhlfeldt, Henrik ; Kerzar, Boris ; Kjebon, Olle
Author_Institution :
Ind. Microelectron. Center, Kista, Sweden
Abstract :
In summary, flip-chip provides a mounting scheme with excellent electrical and thermal properties for high-speed laser diodes. In addition, it is compatible with passive alignment to fibres, thus making it attractive for low-cost packaging of transmitter modules.
Keywords :
flip-chip devices; high-speed optical techniques; modules; optical transmitters; semiconductor device packaging; semiconductor lasers; electrical properties; flip-chip bonding; high-speed laser diodes; low-cost packaging; mounting scheme; optical transmitters; passive alignment; thermal properties; transmitter modules; Bandwidth; Bonding; Diode lasers; Electrodes; Fiber lasers; Frequency; Masers; Semiconductor laser arrays; Silicon; Surface emitting lasers;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1996. LEOS 96., IEEE
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-3160-5
DOI :
10.1109/LEOS.1996.571573
