DocumentCode
2544270
Title
Flip-chip bonding of high-speed laser diodes
Author
Lindgren, Stefan ; Åhlfeldt, Henrik ; Kerzar, Boris ; Kjebon, Olle
Author_Institution
Ind. Microelectron. Center, Kista, Sweden
Volume
2
fYear
1996
fDate
18-21 Nov. 1996
Firstpage
107
Abstract
In summary, flip-chip provides a mounting scheme with excellent electrical and thermal properties for high-speed laser diodes. In addition, it is compatible with passive alignment to fibres, thus making it attractive for low-cost packaging of transmitter modules.
Keywords
flip-chip devices; high-speed optical techniques; modules; optical transmitters; semiconductor device packaging; semiconductor lasers; electrical properties; flip-chip bonding; high-speed laser diodes; low-cost packaging; mounting scheme; optical transmitters; passive alignment; thermal properties; transmitter modules; Bandwidth; Bonding; Diode lasers; Electrodes; Fiber lasers; Frequency; Masers; Semiconductor laser arrays; Silicon; Surface emitting lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society Annual Meeting, 1996. LEOS 96., IEEE
Conference_Location
Boston, MA, USA
Print_ISBN
0-7803-3160-5
Type
conf
DOI
10.1109/LEOS.1996.571573
Filename
571573
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