Title :
Controlling relevant bonding parameters of modern bonders
Author :
Von Raben, K. Ulrich
Author_Institution :
Siemens AG, Munich, West Germany
Abstract :
A portable device is presented that allows the instantaneous measurement and adjustment of relevant bonding parameters. Bonding force and ultrasonic amplitude can be measured simultaneously during a simulated bonding cycle. The device consists of a sensor to be placed under the bonding tip of the bonder and a separate electronic box to prepare the output signals for display and interpretation. The measurement is carried out at room temperature and allows easy bonder adjustment and error detection´
Keywords :
lead bonding; piezoelectric devices; ultrasonic devices; bonding force; bonding parameters; error detection; piezoelectric sensor; portable device; simulated bonding cycle; ultrasonic amplitude; Bonding forces; Bonding processes; Displays; Electronics packaging; Force measurement; Gold; Strain measurement; Temperature sensors; Ultrasonic variables measurement; Wire;
Conference_Titel :
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location :
Los Angeles, CA
DOI :
10.1109/ECC.1988.12648
