Title :
A technique for electrical measurement of ball bond location
Author :
Shirley, C.G. ; Gupta, S.
Author_Institution :
Intel Corp., Chandler, AZ, USA
Abstract :
A test structure incorporating a special bond pad has been developed to make an electrical measurement of the location of a ball bond on a bonding pad. The pad can also be used to measure the electrical resistance of a wire and its bond interfaces (Kelvin measurement). The structure consists of an aluminum bond pad with each corner connected to another bond pad. Four of these 5-pad sense elements are incorporated into small square test die ´modules´. For any specific application test dice can be cut from the wafer in multiples of the module. The authors describe the method and theory of location measurement, and present data to verify the operation of the sensors.<>
Keywords :
electric resistance measurement; lead bonding; position measurement; Al bonding pad; Kelvin measurement; ball bond location; bond interfaces; electrical measurement; electrical resistance; sensors; test dice; test structure; Assembly; Electric variables measurement; Electrical resistance measurement; Fingers; Kelvin; Packaging; Passivation; Testing; Wafer bonding; Wire;
Conference_Titel :
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location :
Los Angeles, CA, USA
DOI :
10.1109/ECC.1988.12649
