DocumentCode
2545651
Title
A multilayered package technology for MMICs
Author
Ida, M. ; Nishikawa, T.
Author_Institution
Murata Mfg. Co., Ltd., Yokohama, Japan
fYear
1993
fDate
June 28 1993-July 2 1993
Firstpage
1013
Abstract
Three packaging technologies are introduced. An MCF (multilayer ceramic frame) single-cavity package shows high performance to Ka-band. An advanced MCF multiple-cavity package exhibits high performance of 26 GHz receiver. A microwave MCM (multichip module) made of BAS substrate demonstrates high performance of the L-band amplifier.<>
Keywords
MMIC power amplifiers; ceramic insulation; integrated circuit packaging; microwave receivers; multichip modules; substrates; 26 GHz; BaO-Al/sub 2/O/sub 3/-SiO/sub 2/ ceramic; Ka-band; L-band amplifier; MMICs; microwave MCM; multichip module; multilayer ceramic frame; multilayered package technology; multiple-cavity package; single-cavity package; Ceramics; Conducting materials; Coplanar waveguides; Dielectric losses; Dielectric substrates; Frequency; Insertion loss; MMICs; Nonhomogeneous media; Packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 1993. AP-S. Digest
Conference_Location
Ann Arbor, MI, USA
Print_ISBN
0-7803-1246-5
Type
conf
DOI
10.1109/APS.1993.385177
Filename
385177
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