Optical interconnection and packaging for active array antennas

Author

Parsons, N.J.

Author_Institution

GEC-Marconi Res. Centre, Chelmsford, UK

fYear

1993

fDate

June 28 1993-July 2 1993

Firstpage

1001

Abstract

Some of the packaged optical components required for signal distribution in active arrays are outlined. The author then reviews recent work at GEC-Marconi, highlighting the potential of optohybrid integration on silicon motherboards for compact optoelectronic interfaces in T/R modules. Silicon motherboard technology offers the following advantages: micromachined structures for alignment of critical optical components; deposited silica waveguides for WDM (wavelength division multiplexing) functions and passive optical interconnect; and high-density MCM (multichip module) processes for electronic interface circuitry.<>

Keywords

active antenna arrays; elemental semiconductors; hybrid integrated circuits; integrated circuit packaging; integrated optoelectronics; micromachining; multichip modules; optical interconnections; optical planar waveguides; silicon; wavelength division multiplexing; MCM; Si motherboard technology; T/R modules; WDM; active array antennas; compact optoelectronic interfaces; deposited silica waveguides; electronic interface circuitry; micromachined structures; multichip module; optohybrid integration; packaged optical components; passive optical interconnect; signal distribution; wavelength division multiplexing; Antenna arrays; Multichip modules; Optical arrays; Optical devices; Optical interconnections; Optical waveguide components; Optical waveguides; Packaging; Silicon compounds; Wavelength division multiplexing;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 1993. AP-S. Digest

Conference_Location

Ann Arbor, MI, USA

Print_ISBN

0-7803-1246-5

Type

conf

DOI

10.1109/APS.1993.385180

Filename

385180