Title :
Advanced ceramic packaging for microwave and millimeter wave applications
Author_Institution :
StratEdge Corp., San Diego, CA, USA
fDate :
June 28 1993-July 2 1993
Abstract :
The StratEdge process, an advanced ceramic packaging technology based on the lamination of fully fired ceramics using a set of proprietary glass compounds and compatible metallizations is described. It combines both innovative and mature processing techniques with new material sets. The process has yielded superior results with respect to electrical, structural, and hermetic performance. The technology is affordable, suitable for high volume production, and does not require customized equipment. To illustrate these considerations, two simple examples of a microwave and a millimeter wave package are presented. A basic DC-20 GHz broadband microwave package is illustrated. The goal of the package is to be electrically transparent to the die and to provide thermal dissipation while maintaining a hermetic and environmentally compatible enclosure. A package that is being developed to address millimeter-wave requirements is also presented.<>
Keywords :
antenna phased arrays; ceramic insulation; cooling; integrated circuit packaging; microwave integrated circuits; millimetre wave integrated circuits; StratEdge process; broadband microwave package; ceramic packaging technology; lamination; millimeter wave package; thermal dissipation; Assembly; Ceramics; Costs; Frequency response; Integrated circuit interconnections; Integrated circuit technology; Microwave devices; Millimeter wave integrated circuits; Millimeter wave technology; Packaging machines;
Conference_Titel :
Antennas and Propagation Society International Symposium, 1993. AP-S. Digest
Conference_Location :
Ann Arbor, MI, USA
Print_ISBN :
0-7803-1246-5
DOI :
10.1109/APS.1993.385182
