Advanced ceramic packaging for microwave and millimeter wave applications

Author

Wein, D.S.

Author_Institution

StratEdge Corp., San Diego, CA, USA

fYear

1993

fDate

June 28 1993-July 2 1993

Firstpage

993

Abstract

The StratEdge process, an advanced ceramic packaging technology based on the lamination of fully fired ceramics using a set of proprietary glass compounds and compatible metallizations is described. It combines both innovative and mature processing techniques with new material sets. The process has yielded superior results with respect to electrical, structural, and hermetic performance. The technology is affordable, suitable for high volume production, and does not require customized equipment. To illustrate these considerations, two simple examples of a microwave and a millimeter wave package are presented. A basic DC-20 GHz broadband microwave package is illustrated. The goal of the package is to be electrically transparent to the die and to provide thermal dissipation while maintaining a hermetic and environmentally compatible enclosure. A package that is being developed to address millimeter-wave requirements is also presented.<>

Keywords

antenna phased arrays; ceramic insulation; cooling; integrated circuit packaging; microwave integrated circuits; millimetre wave integrated circuits; StratEdge process; broadband microwave package; ceramic packaging technology; lamination; millimeter wave package; thermal dissipation; Assembly; Ceramics; Costs; Frequency response; Integrated circuit interconnections; Integrated circuit technology; Microwave devices; Millimeter wave integrated circuits; Millimeter wave technology; Packaging machines;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 1993. AP-S. Digest

Conference_Location

Ann Arbor, MI, USA

Print_ISBN

0-7803-1246-5

Type

conf

DOI

10.1109/APS.1993.385182

Filename

385182