DocumentCode
2545793
Title
Electromagnetic design aspects of packages for phased array modules that may incorporate monolithic antenna elements
Author
Griffin, D.W. ; Parfitt, A.J.
Author_Institution
Dept. of Electr. & Electron. Eng., Adelaide Univ., SA, Australia
fYear
1993
fDate
June 28 1993-July 2 1993
Firstpage
986
Abstract
It is pointed out that, where large floor area packages must be used and damping with lossy material is not acceptable, the electromagnetic design of MMIC (monolithic microwave integrated circuit) packages requires careful analysis for the minimization of cavity resonance effects. If monolithic antenna elements are to be used, then aspects of the antenna array design are directly relevant to package design and the suppression of resonances. The following issues are examined: basic package functions and features; MMIC module layout, package shape, and connections; electromagnetic design problems within packages; and the effect of antenna radiation on package design.<>
Keywords
MMIC; antenna phased arrays; cavity resonators; integrated circuit design; integrated circuit packaging; MMIC; antenna array design; antenna radiation; cavity resonance effects; connections; electromagnetic design; module layout; monolithic antenna elements; monolithic microwave integrated circuit; package design; package shape; phased array modules; Damping; Electromagnetic analysis; Electromagnetic radiation; Integrated circuit packaging; MMICs; Microwave integrated circuits; Minimization; Monolithic integrated circuits; Phased arrays; Resonance;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 1993. AP-S. Digest
Conference_Location
Ann Arbor, MI, USA
Print_ISBN
0-7803-1246-5
Type
conf
DOI
10.1109/APS.1993.385183
Filename
385183
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