Title :
Internet of Things: Trends, challenges and applications
Author :
Kiat Seng Yeo ; Chian, M.C. ; Ng, T.C.W. ; Do Anh Tuan
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
Abstract :
This paper gives an overview of the trends, challenges and applications of the Internet of Things (IoT). It is paving the way towards a smart, interconnected world with infinite opportunities. The multidisciplinary scenario of internet, wireless sensor networks and data fusion which computational intelligence is distributed throughout the physical environment will enable new breeds of services, applications and systems. IoT is the next driver for electronics, in particular IC design in the IoT era will change and shape semiconductor innovation and manufacturing. An “IC design in cloud” is proposed as a turnkey infrastructure for IoT development.
Keywords :
Internet of Things; circuit CAD; cloud computing; integrated circuit design; IC design; Internet of Things; IoT development; cloud computing; semiconductor innovation; semiconductor manufacturing; Cloud computing; Companies; Integrated circuits; Internet of things; Market research; Wireless sensor networks; IC Design in Cloud; Internet of Everything; Internet of Things;
Conference_Titel :
Integrated Circuits (ISIC), 2014 14th International Symposium on
Conference_Location :
Singapore
DOI :
10.1109/ISICIR.2014.7029523
