• DocumentCode
    254606
  • Title

    Investigating measurement methods for high-resolution electromagnetic field side-channel analysis

  • Author

    Specht, R. ; Heyszl, J. ; Sigl, G.

  • Author_Institution
    Fraunhofer Inst. AISEC, Munich, Germany
  • fYear
    2014
  • fDate
    10-12 Dec. 2014
  • Firstpage
    21
  • Lastpage
    24
  • Abstract
    Recent publications have emphasized the power of high-resolution, low-distance EM measurements for side channel analysis. In this paper, we investigate several aspects of such measurements, e.g. different coil-diameters, probe-to-die distances, bandwidths and spatial measurement resolutions. We use an FPGA-based implementation of an AES s-box as device under test and perform measurements of the magnetic near-field. Using the peak amplitude of the magnetic near-field and the Pearson correlation coefficient as quality measures, we show that the probes with smallest diameters lead to the best results. We propose a suitable trade-off between measurement time and measurement quality by using one fourth of the coil diameter as spatial measurement resolution. We show that the correlation is decreasing significantly if a bandwidth less than 300 MHz is used and we recommend a bandwidth of 1 GHz. Additionally, we confirm that the maximum value of the measured EM amplitude decreases by 1/r2, and the correlation of the measurement by 1/r with r being the distance between probe and die.
  • Keywords
    coils; cryptography; electromagnetic fields; field programmable gate arrays; probes; AES s-box; EM measurements; FPGA-based implementation; Pearson correlation coefhcient; coil-diameters; embedded cryptographic devices; high-resolution electromagnetic field side-channel analysis; magnetic near-field; measurement methods; probe-to-die distances; side channel analysis; spatial measurement resolutions; Bandwidth; Correlation; Position measurement; Probes; Spatial resolution; Time measurement; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Circuits (ISIC), 2014 14th International Symposium on
  • Conference_Location
    Singapore
  • Type

    conf

  • DOI
    10.1109/ISICIR.2014.7029532
  • Filename
    7029532