DocumentCode
2546611
Title
On Increasing Signal Integrity with Minimal Decap Insertion in Area-Array SoC Floorplan Design
Author
Lu, Chao-Hung ; Chen, Hung-Ming ; Liu, Chien-Nan Jimmy
Author_Institution
Dept. of Electr. Eng., Nat. Central Univ., Taoyuan
fYear
2007
fDate
23-26 Jan. 2007
Firstpage
792
Lastpage
797
Abstract
With technology further scaling into deep submicron era, power supply noise become an important problem. Power supply noise problem is getting worse due to serious IR-drop and simultaneous switching noise, and decoupling capacitance (decap) insertion is commonly applied to alleviate the noise. There exist some approaches to addressing this issue, but they suffer either from over-design problem or late decap insertion during design stage. In this paper, we propose a methodology to insert decap in a more efficient and effective way during early design stage in area-array designs. The experimental results are encouraging. Compared with other approaches in (Zhao et al., 2002) and (Yan et al., 2005), we have inserted enough decap to meet supply noise constraint while others employ more area.
Keywords
integrated circuit layout; integrated circuit noise; power supply circuits; system-on-chip; IR-drop; area-array SoC floorplan design; decoupling capacitance insertion; power supply noise; signal integrity; supply noise constraint; switching noise; Capacitance; Chaos; Chip scale packaging; Energy consumption; Manufacturing; Noise reduction; Power supplies; Signal design; Very large scale integration; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2007. ASP-DAC '07. Asia and South Pacific
Conference_Location
Yokohama
Print_ISBN
1-4244-0629-3
Electronic_ISBN
1-4244-0630-7
Type
conf
DOI
10.1109/ASPDAC.2007.358086
Filename
4196132
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