DocumentCode
2548625
Title
New nerve cuff electrode based on a shape memory alloy armature
Author
Crampon, M.-A. ; Sawan, M. ; Brailovski, V. ; Trochu, F.
Author_Institution
Dept. of Electr. & Comput. Eng., Ecole Polytech., Montreal, Que., Canada
Volume
5
fYear
1998
fDate
28 Oct-1 Nov 1998
Firstpage
2556
Abstract
The authors present a new nerve cuff electrode based on a shape memory alloy (SMA) armature. This device is dedicated to functional electrical stimulation of the bladder in spinal cord injured patients. The SMA armature performs the closing of the electrode, making its instillation around the nerve much easier, quicker and safer. Both remarkable mechanical properties of SMA materials namely shape memory effect and superelasticity, can be used to obtain the desired actuation of the electrode closing. The manufacturing procedure of this new electrode is described. It does not require any expensive or complex techniques. Bipolar and tripolar electrodes have been manufactured with an inner diameter of 1.6 mm and a cuff wall thickness of 0.8 mm. Acute studies in dogs are being carried out to validate the device and the implantation procedure. In order to test the electrical functionality of the electrode, a fully programmable biphasic stimuli generator has been designed and implemented using FPDs (Field Programmable Devices)
Keywords
biological organs; biomedical electrodes; neuromuscular stimulation; shape memory effects; 0.8 mm; 1.6 mm; bipolar electrodes; cuff wall thickness; dogs; electrical functionality; electrode closing actuation; field programmable devices; fully programmable biphasic stimuli generator; functional electrical stimulation; implantation procedure; manufacturing procedure; spinal cord injured patients; superelasticity; tripolar electrodes; Biomedical electrodes; Bladder; Contacts; Engine cylinders; Manufacturing; Mechanical factors; Platinum; Rubber; Shape memory alloys; Spirals;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1998. Proceedings of the 20th Annual International Conference of the IEEE
Conference_Location
Hong Kong
ISSN
1094-687X
Print_ISBN
0-7803-5164-9
Type
conf
DOI
10.1109/IEMBS.1998.744973
Filename
744973
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