DocumentCode :
2548990
Title :
The effect of polyimide fixation on thermal performance of GaAs cantilever based MEMS: a 3D numerical analysis with DEETEN
Author :
Burian, Eduard ; Lalinsky, Tibor
Author_Institution :
LOX Technol., Bratislava, Slovakia
fYear :
2002
fDate :
14-16 Oct. 2002
Firstpage :
13
Lastpage :
16
Abstract :
We refer of novel simulation technology DEETEN based on spatial domain decomposition, capable of efficient multi-million-point 3D simulations on a conventional PC The technology has been successfully applied to 3D thermal analysis of a GaAs Micromechanical Thermal Converter microsystem.
Keywords :
III-V semiconductors; digital simulation; gallium arsenide; micromechanical devices; polymers; thermal analysis; 3D numerical analysis; 3D thermal analysis; GaAs; GaAs Micromechanical Thermal Converter microsystem; GaAs cantilever based MEMS; multi-million-point 3D simulations; novel simulation technology DEETEN; polyimide fixation; spatial domain decomposition; thermal performance; Analytical models; Circuit simulation; Finite difference methods; Gallium arsenide; Integrated circuit technology; Micromechanical devices; Numerical analysis; Polyimides; Thermal decomposition; Thermal engineering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Devices and Microsystems, 2002. The Fourth International Conference on
Print_ISBN :
0-7803-7276-X
Type :
conf
DOI :
10.1109/ASDAM.2002.1088464
Filename :
1088464
Link To Document :
بازگشت