DocumentCode
254954
Title
Keynote: “High throughput computing data center”
Author
Qinfen Hao
Author_Institution
Shannon Lab., Huawei Corp. Res., China
fYear
2014
fDate
20-22 Aug. 2014
Firstpage
1
Lastpage
1
Abstract
Over the last few decades, data center (DC) technology has evolved from DC 1.0 (tightly-coupled silos) to DC 2.0 (computer virtualization) in order to enhance data processing capability. In the era of big data, highly diversified analytics applications stress data centers. The mounting requirements on throughput, resource utilization, manageability and energy efficiency demand seamless integration of heterogeneous system resources to adapt to varied big data applications, for which DC 2.0 does not sufficient. By rethinking the challenges of big data applications, Huawei proposes High Throughput Computing Data Center architecture (HTC-DC) toward the design of DC 3.0. HTC-DC features resource disaggregation via unified interconnection. It offers PB-level data processing capability, intelligent manageability, high scalability and high energy efficiency, hence a promising candidate for DC 3.0.
Keywords
Big Data; computer centres; virtualisation; DC 1.0; DC 2.0; DC 3.0; DC technology; HTC-DC; Huawei; PB-level data processing capability; big data applications; computer virtualization; data center technology; energy efficiency demand seamless integration; heterogeneous system resources; high throughput computing data center architecture; intelligent manageability; resource utilization; stress data centers; Big data; Computer architecture; Computers; Optical interconnections; Servers; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Embedded and Real-Time Computing Systems and Applications (RTCSA), 2014 IEEE 20th International Conference on
Conference_Location
Chongqing
Type
conf
DOI
10.1109/RTCSA.2014.6910494
Filename
6910494
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