• DocumentCode
    254954
  • Title

    Keynote: “High throughput computing data center”

  • Author

    Qinfen Hao

  • Author_Institution
    Shannon Lab., Huawei Corp. Res., China
  • fYear
    2014
  • fDate
    20-22 Aug. 2014
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Over the last few decades, data center (DC) technology has evolved from DC 1.0 (tightly-coupled silos) to DC 2.0 (computer virtualization) in order to enhance data processing capability. In the era of big data, highly diversified analytics applications stress data centers. The mounting requirements on throughput, resource utilization, manageability and energy efficiency demand seamless integration of heterogeneous system resources to adapt to varied big data applications, for which DC 2.0 does not sufficient. By rethinking the challenges of big data applications, Huawei proposes High Throughput Computing Data Center architecture (HTC-DC) toward the design of DC 3.0. HTC-DC features resource disaggregation via unified interconnection. It offers PB-level data processing capability, intelligent manageability, high scalability and high energy efficiency, hence a promising candidate for DC 3.0.
  • Keywords
    Big Data; computer centres; virtualisation; DC 1.0; DC 2.0; DC 3.0; DC technology; HTC-DC; Huawei; PB-level data processing capability; big data applications; computer virtualization; data center technology; energy efficiency demand seamless integration; heterogeneous system resources; high throughput computing data center architecture; intelligent manageability; resource utilization; stress data centers; Big data; Computer architecture; Computers; Optical interconnections; Servers; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Embedded and Real-Time Computing Systems and Applications (RTCSA), 2014 IEEE 20th International Conference on
  • Conference_Location
    Chongqing
  • Type

    conf

  • DOI
    10.1109/RTCSA.2014.6910494
  • Filename
    6910494