DocumentCode :
2549614
Title :
Signal integrity analysis for high speed digital circuit
Author :
Shang, Erica Ting Mei ; Chyan, Lee Sheng ; Sebastian, Patrick
Author_Institution :
Electr. & Electron. Eng. Dept., Univ. Teknol. PETRONAS, Tronoh, Malaysia
fYear :
2010
fDate :
15-17 June 2010
Firstpage :
1
Lastpage :
6
Abstract :
This paper presents a study on various signal integrity (SI) issues that could affect signals on Printed Circuit Boards (PCBs). This paper is aimed to analyze and have a better understanding on the nature of signal integrity, how the problem is manifested in PCB designs and what design solutions can be employed to minimize its effects. The PCB designs are modelled using the Advanced Design System (ADS). PCB fabrication and testing on the Digital Communication Analyzer (DCA) follows up and the results obtained coincide with theoretical claims obtained at the initial stage of this paper.
Keywords :
digital circuits; printed circuit design; printed circuit testing; PCB designs; PCB fabrication; PCB testing; advanced design system; digital communication analyzer; high speed digital circuit; printed circuit boards; signal integrity analysis; Couplings; Crosstalk; Distortion; Impedance; Microstrip; Reflection; Testing; Printed Circuit Board; Signal integrity; eye diagram;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Intelligent and Advanced Systems (ICIAS), 2010 International Conference on
Conference_Location :
Kuala Lumpur, Malaysia
Print_ISBN :
978-1-4244-6623-8
Type :
conf
DOI :
10.1109/ICIAS.2010.5716113
Filename :
5716113
Link To Document :
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