Signal integrity analysis for high speed digital circuit

Author

Shang, Erica Ting Mei ; Chyan, Lee Sheng ; Sebastian, Patrick

Author_Institution

Electr. & Electron. Eng. Dept., Univ. Teknol. PETRONAS, Tronoh, Malaysia

fYear

2010

fDate

15-17 June 2010

Firstpage

1

Lastpage

6

Abstract

This paper presents a study on various signal integrity (SI) issues that could affect signals on Printed Circuit Boards (PCBs). This paper is aimed to analyze and have a better understanding on the nature of signal integrity, how the problem is manifested in PCB designs and what design solutions can be employed to minimize its effects. The PCB designs are modelled using the Advanced Design System (ADS). PCB fabrication and testing on the Digital Communication Analyzer (DCA) follows up and the results obtained coincide with theoretical claims obtained at the initial stage of this paper.

Keywords

digital circuits; printed circuit design; printed circuit testing; PCB designs; PCB fabrication; PCB testing; advanced design system; digital communication analyzer; high speed digital circuit; printed circuit boards; signal integrity analysis; Couplings; Crosstalk; Distortion; Impedance; Microstrip; Reflection; Testing; Printed Circuit Board; Signal integrity; eye diagram;

fLanguage

English

Publisher

ieee

Conference_Titel

Intelligent and Advanced Systems (ICIAS), 2010 International Conference on

Conference_Location

Kuala Lumpur, Malaysia

Print_ISBN

978-1-4244-6623-8

Type

conf

DOI

10.1109/ICIAS.2010.5716113

Filename

5716113