Title :
A pulse-echo ultrasonic technique for the localization of the solid-liquid interface during directional solidification of silicon ingots
Author :
Eyer, A. ; Haas, F. ; Schätzle, P. ; Räuber, A. ; Knobel, R.M.
Author_Institution :
Fraunhofer-Inst. fuer Solare Energiesyst., Freiburg, Germany
Abstract :
A special ultrasonic technique is discussed and experiments in a solidification process for 24 kg ingots are reported. The ultrasonic signal is generated and received by the same piezoelectric transducer. As direct contact of the transducer with the silicon melt is impossible, a transmission rod is used. It is dipped into the melt at one end, and bears the transducer at its cold end. This rod is the most critical part of the system. Several materials were under consideration, and some of them were tested. Clear echoes from the solid-liquid interface were received with transmission rods made of SiC, Al2O3, and monocrystalline Si
Keywords :
directional solidification; elemental semiconductors; piezoelectric transducers; silicon; ultrasonic materials testing; ultrasonic transducers; Al2O3; Si ingots; SiC; directional solidification; monocrystalline Si; piezoelectric transducer; pulse-echo ultrasonic technique; solid-liquid interface; transmission rod; Piezoelectric transducers; Production; Radiography; Silicon; Solids; Surface emitting lasers; Temperature; Ultrasonic imaging; Ultrasonic transducers; Velocity control;
Conference_Titel :
Photovoltaic Specialists Conference, 1991., Conference Record of the Twenty Second IEEE
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-87942-636-5
DOI :
10.1109/PVSC.1991.169356