Title :
A compact CMOS Marchand balun incorporating meandered multilayer edge-coupled transmission lines
Author :
Chiang, Meng-Ju ; Wu, Hsien-Shun ; Tzuang, Ching-Kuang C.
Author_Institution :
Grad. Inst. of Commun. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
This work presents a compact CMOS Marchand balun design, which consists of the meandered two-conductor edge-coupled complementary-conducting-strip coupled-line (CCS CL). The CCS CL, which is fully compatible with the standard CMOS process, provides various structural parameters to synthesize the desired coupling coefficient for Marchand balun realization. The prototype, which is fabricated by the standard 0.18-mum 1P6M CMOS technology, reveals circuit size of 240.0 mum times 240.0 mum (without contact pads). The measured results, which are collected based on 50-Omega system, demonstrate excellent agreements with those of the simulations. The input return loss is less than -15.0 dB from 21.6 GHz to 33.1 GHz. The measured insertion losses between input and two output ports (S21 and S31) are 5.90 dB and 4.38 dB at 23.6 GHz, respectively. The phase difference between two output ports is 180deg plusmn 10deg from 15.5 GHz to 40.0 GHz.
Keywords :
CMOS integrated circuits; baluns; coupled transmission lines; field effect MIMIC; field effect MMIC; multiconductor transmission lines; circuit size; compact CMOS Marchand balun design; coupling coefficient; frequency 15.5 GHz to 40.0 GHz; input return loss; insertion losses; loss 4.38 dB; loss 5.90 dB; meandered multilayer edge-coupled transmission lines; monolithic microwave integrated circuit; phase difference; size 0.18 mum; standard CMOS technology; two-conductor edge-coupled complementary-conducting-strip coupled-line; CMOS process; CMOS technology; Carbon capture and storage; Circuit synthesis; Coupling circuits; Impedance matching; Nonhomogeneous media; Prototypes; Structural engineering; Transmission lines; Marchand balun; RF CMOS; coupled transmission lines; monolithic microwave integrated circuit (MMIC);
Conference_Titel :
Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
Conference_Location :
Boston, MA
Print_ISBN :
978-1-4244-2803-8
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2009.5165648