DocumentCode
2551477
Title
US leadership loss in microelectronics could seriously impact aerospace applications
Author
Jackson, A.S. ; Jackson, E.S.
Author_Institution
Motorola Inc., Orange, CA, USA
fYear
1990
fDate
4-9 Feb. 1990
Firstpage
281
Lastpage
312
Abstract
The authors analyse changes in US and Japanese semiconductor industry. They consider how changes in the industry have affected, and will continue to affect, aerospace design engineers. The emphasis is on the advanced microelectronic products. Attention is focused on the high reliability and extended temperature range devices as well as on the full military specification and radiation-hardened (rad-hard) parts. It is found that, in 1989, Japanese firms made almost 50% of worldwide semiconductor sales, compared to less than 40% for all North American companies. Furthermore, in 1990, 90% of all dynamic random access memory chips were made by Japanese firms. The Japanese are also ahead of the US in some of the critical microelectronic R&D areas such as GaAs rad-hard devices.<>
Keywords
DRAM chips; aerospace industry; integrated circuit manufacture; integrated circuit technology; integrated memory circuits; military equipment; radiation hardening (electronics); reliability; technological forecasting; GaAs; Japanese semiconductor industry; R&D; United States; aerospace applications; dynamic random access memory chips; microelectronics; military specification; radiation hardened components; reliability; Aerospace engineering; Aerospace industry; Defense industry; Design engineering; Electronics industry; Marketing and sales; Microelectronics; Radiation hardening; Reliability engineering; Temperature distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Aerospace Applications Conference, 1990. Digest., 1990 IEEE
Conference_Location
Vail, CO, USA
Type
conf
DOI
10.1109/AERO.1990.109092
Filename
109092
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