Title :
Scanning acoustic microscope (SAM)-a measurement tool for plastic IC packages
Author :
Nagalingam, Jeanti ; Mohd-Yusoff, S. Dayu ; Ramakrishnan, Puranam ; Jaafar, Rosli ; Francis, Caroline
Author_Institution :
Device Anal. Lab., Adv. Micro Devices Export, Penang, Malaysia
Abstract :
Theoretically, using a 15 MHz transducer, the Scanning Acoustic Microscope (SAM) is shown to have a detection capability of a peak within λ/4 for a depth of 0.06 mm of a typical plastic IC package. A gauge R&R study to determine inspection capability revealed that SAM has a PT ratio of 15.72%. This shows that SAM can be used as a standard measurement tool in plastic IC package dimension measurement. Through a similar methodology used to perform gauge R&R, accurate die paddle tilt measurement was performed with SAM to solve a latent reliability problem for S044 packages with low die paddle tilt/displacement
Keywords :
acoustic microscopy; inspection; integrated circuit measurement; integrated circuit packaging; integrated circuit reliability; plastic packaging; spatial variables measurement; 15 MHz; PT ratio; S044 packages; SAM; detection capability; die paddle tilt measurement; dimension measurement; displacement measurement; gauge R&R study; inspection capability; measurement tool; plastic IC package measurement; reliability problem; scanning acoustic microscope; transducer; Acoustic devices; Acoustic measurements; Acoustic signal detection; Acoustic transducers; Measurement standards; Microscopy; Oscilloscopes; Plastic integrated circuit packaging; Time measurement; Vehicle detection;
Conference_Titel :
Physical & Failure Analysis of Integrated Circuits, 1997., Proceedings of the 1997 6th International Symposium on
Print_ISBN :
0-7803-3985-1
DOI :
10.1109/IPFA.1997.638324
