DocumentCode :
2552169
Title :
Compact low-cost 1-Watt and 4-Watt quad flat non-leaded (QFN) packaged Ka-Band high power amplifiers
Author :
Suh, Young-Ho ; Chen, Shuoqi
Author_Institution :
TriQuint Semicond., Richardson, TX, USA
fYear :
2009
fDate :
7-12 June 2009
Firstpage :
545
Lastpage :
548
Abstract :
This paper presents the design and performance of two new quad flat non-leaded (QFN) packaged high power amplifiers operating at Ka-band. The packaged amplifiers are fully compatible with conventional SMD assembly processes which significantly reduce assembly cost and complexity. The QFNs themselves are standard off-the-shelf low-cost plastic air-cavity packages. Matching networks that were designed to compensate packaging and wire-bond related parasitics was presented. The 1-Watt 4 times 4 mm2 QFN packaged amplifier demonstrates min. +30 dBm CW saturated output power with power added efficiency (PAE) of 26%, and min. +20 dB small signal gain from 28 to 31 GHz. The 4-watt 5 times 5 mm2 QFN packaged amplifier exhibits min. +35 dBm CW saturated output power with at least 20 dB small signal gain from 28 to 31 GHz. Saturated output power of +36 dBm was achieved from 29 to 31 GHz with PAE of 23%. Thermal analysis of the channel temperatures was also presented. To authors´ knowledge, these amplifiers are the first Ka-band packaged amplifiers to produce 1-watt and 4-watt saturated output power using standard plastic QFNs with the smallest sizes.
Keywords :
MMIC amplifiers; millimetre wave amplifiers; power amplifiers; Ka-band packaged amplifiers; MMIC; SMD assembly processes; frequency 28 GHz to 31 GHz; matching networks; off-the-shelf low-cost plastic air-cavity packages; power 1 W; power 4 W; power added efficiency; quad flat nonleaded packaged high power amplifiers; thermal analysis; wire-bond related parasitics; Assembly; Costs; Gallium arsenide; High power amplifiers; MMICs; PHEMTs; Plastics; Power amplifiers; Power generation; Semiconductor device packaging; Ka-Band; MMIC amplifiers; Packaged MMIC; Power amplifier; QFN; pHEMT;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
Conference_Location :
Boston, MA
ISSN :
0149-645X
Print_ISBN :
978-1-4244-2803-8
Electronic_ISBN :
0149-645X
Type :
conf
DOI :
10.1109/MWSYM.2009.5165754
Filename :
5165754
Link To Document :
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