• DocumentCode
    2552169
  • Title

    Compact low-cost 1-Watt and 4-Watt quad flat non-leaded (QFN) packaged Ka-Band high power amplifiers

  • Author

    Suh, Young-Ho ; Chen, Shuoqi

  • Author_Institution
    TriQuint Semicond., Richardson, TX, USA
  • fYear
    2009
  • fDate
    7-12 June 2009
  • Firstpage
    545
  • Lastpage
    548
  • Abstract
    This paper presents the design and performance of two new quad flat non-leaded (QFN) packaged high power amplifiers operating at Ka-band. The packaged amplifiers are fully compatible with conventional SMD assembly processes which significantly reduce assembly cost and complexity. The QFNs themselves are standard off-the-shelf low-cost plastic air-cavity packages. Matching networks that were designed to compensate packaging and wire-bond related parasitics was presented. The 1-Watt 4 times 4 mm2 QFN packaged amplifier demonstrates min. +30 dBm CW saturated output power with power added efficiency (PAE) of 26%, and min. +20 dB small signal gain from 28 to 31 GHz. The 4-watt 5 times 5 mm2 QFN packaged amplifier exhibits min. +35 dBm CW saturated output power with at least 20 dB small signal gain from 28 to 31 GHz. Saturated output power of +36 dBm was achieved from 29 to 31 GHz with PAE of 23%. Thermal analysis of the channel temperatures was also presented. To authors´ knowledge, these amplifiers are the first Ka-band packaged amplifiers to produce 1-watt and 4-watt saturated output power using standard plastic QFNs with the smallest sizes.
  • Keywords
    MMIC amplifiers; millimetre wave amplifiers; power amplifiers; Ka-band packaged amplifiers; MMIC; SMD assembly processes; frequency 28 GHz to 31 GHz; matching networks; off-the-shelf low-cost plastic air-cavity packages; power 1 W; power 4 W; power added efficiency; quad flat nonleaded packaged high power amplifiers; thermal analysis; wire-bond related parasitics; Assembly; Costs; Gallium arsenide; High power amplifiers; MMICs; PHEMTs; Plastics; Power amplifiers; Power generation; Semiconductor device packaging; Ka-Band; MMIC amplifiers; Packaged MMIC; Power amplifier; QFN; pHEMT;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
  • Conference_Location
    Boston, MA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4244-2803-8
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2009.5165754
  • Filename
    5165754