DocumentCode :
2552324
Title :
New vertical silicon microwave power transistor structure and package with inherent thermal self protection
Author :
Gogoi, Bishnu ; Davies, Robert ; Crowder, Jeff ; Lutz, David ; Le, Phuong ; Rice, David ; Wright, Walt ; Battaglia, Brian ; Tran, Son ; Elliott, A. Lex ; Golio, Mike
Author_Institution :
HVVi Semicond. Inc., Phoenix, AZ, USA
fYear :
2009
fDate :
7-12 June 2009
Firstpage :
569
Lastpage :
572
Abstract :
A novel vertical silicon high voltage microwave power transistor is reported with high degree of robustness and inherent thermal self protection. The HVVFET device uses a deep dielectric platform with uniform channel doping that approaches near ideal breakdown voltages (> 110 Volts) for suitable epitaxial thickness and doping levels resulting in high power density. An integrated shield enables significant reduction in the feedback capacitance resulting in devices with fT > 6 GHz and gain in excess of 15 dB, with VSWR of 20:1. Flip-chip gold bumps are used to achieve short thermal transfer path to the flange and achieve inherent thermal self protection.
Keywords :
flip-chip devices; microwave power transistors; power field effect transistors; thermal stability; channel doping; flip-chip gold bumps; microwave power transistor; thermal self protection; thermal transfer path; Dielectric devices; Doping; Feedback; Microwave devices; Packaging; Power transistors; Protection; Robustness; Silicon; Voltage; Flip-chip RF power transistor; High Voltage power transistor; Ruggedness; Silicon Power Transistor; Vertical RF transistor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
Conference_Location :
Boston, MA
ISSN :
0149-645X
Print_ISBN :
978-1-4244-2803-8
Electronic_ISBN :
0149-645X
Type :
conf
DOI :
10.1109/MWSYM.2009.5165760
Filename :
5165760
Link To Document :
بازگشت