DocumentCode
2552369
Title
Temperature Dependent Electrical Characterization of Organic Semiconductor Diodes Deposited at 277g
Author
Moiz, S.A. ; Ahmed, M.M. ; Karimov, K.S. ; Mehmood, M.
Author_Institution
National Centre for Nanotechnology, Pakistan Inst. of Eng. & Appl. Sci., Islamabad
fYear
2006
fDate
23-24 Dec. 2006
Firstpage
467
Lastpage
471
Abstract
In this study thin films of poly-N epoxipropylcarbazole (PEPC) doped by anthracene (An) were deposited over the surface of nickel (Ni) substrate at the gravity condition of 277g (where g = 9.81 m2/sec). The current-voltage (I-V) characteristics of the fabricated devices (Ga/PEPC/Ni) were determined at different ambient temperature environment ranging from 30 degC to 60 degC. From the conductivity versus temperature response of the devices derived from their I-V characteristics, it is observed that devices follow three dimension variable range hopping phenomena for their charge transport mechanism. By applying variable range hopping charge transport model, hopping conduction parameters of organic semiconductor material are estimated. From the results of these estimations, the dependence of electrical properties of the devices as a function of temperature is evaluated and discussed
Keywords
elemental semiconductors; gallium; hopping conduction; nickel; organic semiconductors; semiconductor diodes; thin films; 30 to 60 C; 3D variable range hopping phenomena; Ga; anthracene; charge transport mechanism; current-voltage characteristics; electrical properties; hopping charge transport model; hopping conduction parameters; organic semiconductor diodes; organic semiconductor material; poly-N epoxipropylcarbazole; thin films; Conductivity; Gravity; Nickel; Organic semiconductors; Semiconductor diodes; Semiconductor thin films; Sputtering; Substrates; Temperature dependence; Temperature distribution; Centrifugal thin film; PEPC; component; temperature-dependence performance; variable range hopping model;
fLanguage
English
Publisher
ieee
Conference_Titel
Multitopic Conference, 2006. INMIC '06. IEEE
Conference_Location
Islamabad
Print_ISBN
1-4244-0795-8
Electronic_ISBN
1-4244-0795-8
Type
conf
DOI
10.1109/INMIC.2006.358212
Filename
4196455
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