• DocumentCode
    2552460
  • Title

    DC-to-50 GHz compensation structure for flip-chip assembled SPST MEMS switch

  • Author

    Hettak, K. ; Morin, G.A. ; Stubbs, M.G.

  • Author_Institution
    Commun. Res. Centre Canada, Ottawa, ON, Canada
  • fYear
    2009
  • fDate
    7-12 June 2009
  • Firstpage
    597
  • Lastpage
    600
  • Abstract
    A new structure is proposed which simply compensates the flip-chip mounting effect. As an example which shows the mounting effect and the validity of the compensation structure, a discrete RF MEMS SPST switch is used. The degraded frequency response of the RF MEMS SPST switch when it is flipped into a coplanar transmission line is successfully recovered simply by adding the proposed compensation structure. It consists of inserting the proper sizes of CPW series stubs. Whereas conventional wire bonding of discrete MEMS switches in MIC circuits prevents the realization of very low loss characteristics of the switch, models of a flip-chipped MEMS switch show it is possible to retain the low loss characteristics by using some of the novel characteristics of coplanar transmission lines. The principle of achieving such high-quality compensation structure is detailed and is also confirmed by experimental results up to at least 50 GHz. It is shown that a return loss better than 18 dB in the frequency range up to 50 GHz is achievable. Finally, applying this simple compensation structure, the frequency range of operation can be further extended.
  • Keywords
    MMIC; coplanar transmission lines; coplanar waveguides; flip-chip devices; frequency response; microswitches; CPW series stub; DC compensation structure; MIC circuit; conventional wire bonding; coplanar transmission line; flip-chip assembled SPST MEMS switch; flip-chip mounting effect; frequency 50 GHz; frequency response; return loss; Assembly; Coplanar transmission lines; Coplanar waveguides; Degradation; Frequency response; Microswitches; Propagation losses; Radiofrequency microelectromechanical systems; Switches; Wire; CPW; Flip-Chip; Packaging; RF MEMS; Series stub; Switch;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
  • Conference_Location
    Boston, MA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4244-2803-8
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2009.5165767
  • Filename
    5165767