DocumentCode :
2552460
Title :
DC-to-50 GHz compensation structure for flip-chip assembled SPST MEMS switch
Author :
Hettak, K. ; Morin, G.A. ; Stubbs, M.G.
Author_Institution :
Commun. Res. Centre Canada, Ottawa, ON, Canada
fYear :
2009
fDate :
7-12 June 2009
Firstpage :
597
Lastpage :
600
Abstract :
A new structure is proposed which simply compensates the flip-chip mounting effect. As an example which shows the mounting effect and the validity of the compensation structure, a discrete RF MEMS SPST switch is used. The degraded frequency response of the RF MEMS SPST switch when it is flipped into a coplanar transmission line is successfully recovered simply by adding the proposed compensation structure. It consists of inserting the proper sizes of CPW series stubs. Whereas conventional wire bonding of discrete MEMS switches in MIC circuits prevents the realization of very low loss characteristics of the switch, models of a flip-chipped MEMS switch show it is possible to retain the low loss characteristics by using some of the novel characteristics of coplanar transmission lines. The principle of achieving such high-quality compensation structure is detailed and is also confirmed by experimental results up to at least 50 GHz. It is shown that a return loss better than 18 dB in the frequency range up to 50 GHz is achievable. Finally, applying this simple compensation structure, the frequency range of operation can be further extended.
Keywords :
MMIC; coplanar transmission lines; coplanar waveguides; flip-chip devices; frequency response; microswitches; CPW series stub; DC compensation structure; MIC circuit; conventional wire bonding; coplanar transmission line; flip-chip assembled SPST MEMS switch; flip-chip mounting effect; frequency 50 GHz; frequency response; return loss; Assembly; Coplanar transmission lines; Coplanar waveguides; Degradation; Frequency response; Microswitches; Propagation losses; Radiofrequency microelectromechanical systems; Switches; Wire; CPW; Flip-Chip; Packaging; RF MEMS; Series stub; Switch;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
Conference_Location :
Boston, MA
ISSN :
0149-645X
Print_ISBN :
978-1-4244-2803-8
Electronic_ISBN :
0149-645X
Type :
conf
DOI :
10.1109/MWSYM.2009.5165767
Filename :
5165767
Link To Document :
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