DocumentCode
2552460
Title
DC-to-50 GHz compensation structure for flip-chip assembled SPST MEMS switch
Author
Hettak, K. ; Morin, G.A. ; Stubbs, M.G.
Author_Institution
Commun. Res. Centre Canada, Ottawa, ON, Canada
fYear
2009
fDate
7-12 June 2009
Firstpage
597
Lastpage
600
Abstract
A new structure is proposed which simply compensates the flip-chip mounting effect. As an example which shows the mounting effect and the validity of the compensation structure, a discrete RF MEMS SPST switch is used. The degraded frequency response of the RF MEMS SPST switch when it is flipped into a coplanar transmission line is successfully recovered simply by adding the proposed compensation structure. It consists of inserting the proper sizes of CPW series stubs. Whereas conventional wire bonding of discrete MEMS switches in MIC circuits prevents the realization of very low loss characteristics of the switch, models of a flip-chipped MEMS switch show it is possible to retain the low loss characteristics by using some of the novel characteristics of coplanar transmission lines. The principle of achieving such high-quality compensation structure is detailed and is also confirmed by experimental results up to at least 50 GHz. It is shown that a return loss better than 18 dB in the frequency range up to 50 GHz is achievable. Finally, applying this simple compensation structure, the frequency range of operation can be further extended.
Keywords
MMIC; coplanar transmission lines; coplanar waveguides; flip-chip devices; frequency response; microswitches; CPW series stub; DC compensation structure; MIC circuit; conventional wire bonding; coplanar transmission line; flip-chip assembled SPST MEMS switch; flip-chip mounting effect; frequency 50 GHz; frequency response; return loss; Assembly; Coplanar transmission lines; Coplanar waveguides; Degradation; Frequency response; Microswitches; Propagation losses; Radiofrequency microelectromechanical systems; Switches; Wire; CPW; Flip-Chip; Packaging; RF MEMS; Series stub; Switch;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
Conference_Location
Boston, MA
ISSN
0149-645X
Print_ISBN
978-1-4244-2803-8
Electronic_ISBN
0149-645X
Type
conf
DOI
10.1109/MWSYM.2009.5165767
Filename
5165767
Link To Document