Title :
Substrate-embedded millimeter wave SiGe VCO chip
Author :
Richter, Marius D. ; Schneider, Martin
Author_Institution :
RF & Microwave Eng. Lab., Univ. of Bremen, Bremen, Germany
Abstract :
A 77 GHz SiGe voltage controlled oscillator (VCO) chip is completely buried inside a printed circuit board (PCB) and connected to a high frequency laminate on top of the PCB using microvias. Several modules each containing a buried VCO chip are fabricated. The performance of these buried VCO chips regarding tuning range and output power is comparable with the measured performance of a classically connected VCO chip using wire bond technology. The successful operation of active monolithic microwave integrated circuits (MMICs) buried inside PCBs shows the potential of the novel technology used here.
Keywords :
Ge-Si alloys; MMIC; integrated circuit packaging; printed circuit design; voltage-controlled oscillators; MMIC; SiGe; SiGe VCO chip; frequency 77 GHz; monolithic microwave integrated circuit; printed circuit board; substrate-embedded millimeter wave; voltage controlled oscillator; Frequency; Germanium silicon alloys; Integrated circuit technology; Laminates; MMICs; Millimeter wave circuits; Millimeter wave technology; Printed circuits; Silicon germanium; Voltage-controlled oscillators; MMIC oscillators; integrated circuit packaging; printed circuit layout; tunable oscillators;
Conference_Titel :
Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
Conference_Location :
Boston, MA
Print_ISBN :
978-1-4244-2803-8
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2009.5165769
