Title :
Subminiature silicon integrated electret condenser microphone
Author :
Murphy, P. ; Hubschi, K. ; de Rooij, N. ; Racine, G.A.
Author_Institution :
Lectret SA, Geneva, Switzerland
Abstract :
Summary form only given. The authors have developed microphones which use one silicon wafer to support a thin polyester diaphragm and a second to carry a Teflon electret. Subassemblies are diced from the wafer and bonded together to form complete microphones. The preamplifier circuit can be carried on either subassembly. Microphones with reasonable signal-to-noise ratio can be obtained with edge dimensions of 3 mm or less.<>
Keywords :
electrets; elemental semiconductors; integrated circuits; microphones; polymers; silicon; Teflon electret; integrated Si; microphones; preamplifier circuit; semiconductor; signal-to-noise ratio; thin polyester diaphragm; Circuits; Electrets; Impedance matching; Micromachining; Microphones; Preamplifiers; Signal to noise ratio; Wafer bonding;
Conference_Titel :
Electrets, 1988. (ISE 6) Proceedings., 6th International Symposium on (IEEE Cat. No.88CH2593-2)
Conference_Location :
Oxford, UK
DOI :
10.1109/ISE.1988.38551
