DocumentCode :
2552971
Title :
High performance active pixel sensors fabricated in a standard 2.0 μm CMOS technology
Author :
Mestanza, S.N.M. ; Jimenez, H.G. ; Silva, I.F. ; Diniz, J.A. ; Doi, I. ; Swart, J.W.
Author_Institution :
Centro de Componentes Semicondutores, CCS/FEEC-UNICAMP, Campinas, Brazil
Volume :
1
fYear :
2004
fDate :
3-5 Nov. 2004
Firstpage :
276
Lastpage :
280
Abstract :
This paper reports the development of a CMOS active pixel sensor using a good performance readout circuit. The sensor element is a photodiode implemented with n-well. Using a CMOS process based on the 2μm technology, the sensor was entirely developed in our research center. The parameters used in the CMOS process were SiO2 thickness of Tox= 30nm, junction depths (XJn and XJp) of 0.45μm and gate of n+ poly-Si. Under this conditions threshold voltages of Vtn=0.8V and Vtp=0.7V were obtained for VDS=0.1V. Each detector pixel in the array occupies a 130×130μm2 area with a fill-factor ∼ 22%, consumed power for pixel ∼ 2mW, dark current density 3μA/cm2 in 25°C. Pspice simulated results are in agreement with the experimental measurements in our APS structures under different illumination levels.
Keywords :
CMOS image sensors; SPICE; current density; photodetectors; photodiodes; readout electronics; 0.1 V; 0.45 micron; 0.7 V; 0.8 V; 2.0 micron; 25 C; 30 nm; APS structure; CMOS active pixel sensor; Pspice; SiO2; dark current density; detector pixel; junction depth; n+ poly-Si; photodiode; readout circuit; threshold voltage; CMOS image sensors; CMOS process; CMOS technology; Carbon capture and storage; Circuits; Dark current; Image sensors; Lighting; Optical imaging; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Devices, Circuits and Systems, 2004. Proceedings of the Fifth IEEE International Caracas Conference on
Print_ISBN :
0-7803-8777-5
Type :
conf
DOI :
10.1109/ICCDCS.2004.1393397
Filename :
1393397
Link To Document :
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