Title :
Miniaturized hybrid ring circuits using T-type folded substrate integrated waveguide (TFSIW)
Author :
Ding, Yan ; Wu, Ke
Author_Institution :
Dept. of Elec. Eng., Ecole Polytech. (Univ. of Montreal), Montreal, QC, Canada
Abstract :
T-type folded substrate integrated waveguide (TFSIW) scheme is an effective SIW miniaturization technique for developing high-density integrated circuits. In this paper, the propagation constant and characteristic impedance of TFSIW structures are analyzed on the basis of their equivalent circuits. To demonstrate the circuit applications, the design procedure of a proposed TFSIW hybrid ring is presented and discussed with reference to the calculated parameters. Simulation results of the designed coupler ring circuit are compared with measurement results.
Keywords :
coupled circuits; electric impedance; equivalent circuits; substrate integrated waveguides; SIW miniaturization; T-type folded substrate integrated waveguide; TFSIW structure; characteristic impedance; circuit design; coupler ring circuit; equivalent circuit; high-density integrated circuit; miniaturized hybrid ring circuit; propagation constant; Circuit simulation; Coupling circuits; Equivalent circuits; Impedance; Integrated circuit measurements; Microwave theory and techniques; Propagation constant; Radio frequency; Research and development; Substrates;
Conference_Titel :
Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
Conference_Location :
Boston, MA
Print_ISBN :
978-1-4244-2803-8
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2009.5165794